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Researcher Experience |
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Technology Road Map |
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2007 |
2008 |
| 1Q |
2Q |
3Q |
4Q |
1Q |
2Q |
3Q |
4Q |
| High Tg |
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| Tg > 250 ℃ (Polyimide) |
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V |
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| Tg >180-220 ℃ (IC Substrate) |
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V |
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O |
| Low D.K. Laminate |
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| D.K. < 3.9, D.F.< 0.01 |
V |
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O |
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| D.K. < 3.5, D.F.< 0.005 |
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V |
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O |
| Bonding Sheet |
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| High Tg No Flow Prepreg |
O |
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| Halogen Free No Flow Prepreg |
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V |
O |
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| Halogen Free (Green) |
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| High Tg, Halogen Free |
V |
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O |
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| FCCL |
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| 2 Layer |
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V |
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O |
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| 3 Layer, Halogen Free |
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V |
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O |
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| 3 Layer, High Tg |
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V |
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O |
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