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  Product Home > Products > Product > CCL&PP > Normal Tg > IT-140BS/IT-140TC
| IT-140BS/IT-140TC |
 
  IT-140BS/IT-140TC
 
Features
 

IT-140BS/IT-140TC

Medium Tg Tetra-Functional Epoxy Resin and Dicy-Cured Laminate & Prepreg

IT-140 is a medium Tg (>135 by DSC) trtra-functional epoxy with AOI and UV blocking resin system. Dicy cured and 94 V-0. Suitable for consumer application.

Key Features ===============================

Resin Technology

    Industrial standard material with medium Tg (135 by DSC) tetra-functional epoxy resin and dicy cured.

Good Thermal Reliability

RoHS compliant and suitable for thermal reliability needs. High peel strength value and better reliability compared with the similar resin system of competitor’s.

Friendly Processing and CAF Resistance

Friendly to PCB process that users can easily handle the process by current equipment and chemical.

AOI and UV Blocking

   It’s good for AOI and UV blocking of PCB imaging inspection process.

Available in Variety of Constructions

Available in a various of constructions, copper weights and glass styles, including standard(HTE), RTF and VLP copper foil.

 

 

 

 

 

 

Applications

PC and Notebook

Memory Module

Game Player

Consumer and Multilayer PCB

 

 

 

Industrial Approval

UL 94 V-0

IPC-4101C Spec / 21

RoHS Compliant

 

   
Properties
 

ITEQ  Laminate/ Prepreg : IT-140TC / IT-140BS

IPC-4101A Spec / 21

LAMINATE(IT-140TC) 

Property

Thickness<0.50 mm

            [0.0197 in]

Thickness0.50 mm

             [0.0197 in]

Units

Test Method

Typical Value

Spec

Typical Value

Spec

Metric

(English)

IPC-TM-650

(or as noted)

Peel Strength, minimum

A.   Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil]

B.   Standard profile copper foil

1.     After Thermal Stress

2.     At 125°C [257 F]

3.     After Process Solutions

 

 

0.96 (5.5)

 

 

1.75 (10 )

1.66 (9.5)

1.49 (8.5)

 

 

0.70 (4.0)

 

 

0.80 (4.57)

0.70 (4.00)

0.55 (3.14)

 

 

0.96 (5.5)

 

 

 1.93 (11.0)

1.66 (9.5)

1.49 (8.5)

 

 

0.70 (4.0)

 

 

1.05 (6.00)

0.70 (4.00)

0.80 (4.57)

N/mm

(lb/inch)

2.4.8

2.4.8.2

2.4.8.3

Volume Resistivity, minimum

     A.  C-96/35/90

     B.  After moisture resistance

     C.  At elevated temperature E-24/125

 

5x1010

--

5x1010

 

106

--

103

 

--

5x1010

5x1010

 

--

104

103

MW-cm

2.5.17.1

Surface Resistivity, minimum

     A.  C-96/35/90

     B.  After moisture resistance

     C.  At elevated temperature E-24/125

 

3.5x1010

--

6x1010

 

104

--

103

 

--

3.5x1010

6x1010

 

--

104

103

MW

2.5.17.1

Moisture Absorption, maximum

0.30

--

0.1

0.8

%

2.6.2.1

Dielectric Breakdown, minimum

--

--

60

40

kV

2.5.6

Permittivity (Dk, 50% resin content)

 (Laminate & Laminated Prepreg)

A. 1MHz

4.6

5.4

4.6

5.4

--

2.5.5.9

Loss Tangent (Df, 50% resin content)

 (Laminate & Laminated Prepreg)

A. 1MHz

0.016

0.035

0.016

0.035

--

2.5.5.9

Flexural Strength, minimum

     A.  Length direction

 

     B.  Cross direction

 

 

--

--

--

--

 

--

--

--

--

 

500-530

(72,500-76,850)

430-460

(62,350-66,700)

 

415

(60,190)

345

(50,140)

N/mm2

(lb/in2)

2.4.4

Arc Resistance, minimum

120

60

120

60

s

2.5.1

Thermal Stress 10 s at 288°C [550.4F],minimum

A.   Unetched

B.   Etched

 

Pass

Pass

 

Pass Visual
Pass
Visual

 

Pass

Pass

 

Pass Visual

Pass Visual

Rating

2.4.13.1

Electric Strength, minimum

 (Laminate & Laminated Prepreg)

45

30

--

--

kV/mm

2.5.6.2

Flammability,

  (Laminate & Laminated Prepreg)

V-0

V-0

V-0

V-0

Rating

UL94

Glass Transition Temperature(DSC)

140

135 minimum

140

135 minimum

˚C

2.4.25

Decomposition Temperature

--

--

305

--

˚C

2.4.24.6

(5% wt loss)

Z-Axis CTE

 A.  Alpha 1

 B.  Alpha 2

 C.  50 to 260 Degrees C

 

--

--

--

 

--

--

--

 

55

290

4.2


--
--
--

 

ppm/˚C

ppm/˚C

%

2.4.24

Thermal Resistance

A.  T260

B.  T288

 

--

--

 

--
--

 

15

2


--

--


Minutes
Minutes

2.4.24.1

CAF Resistance

--

--

Pass

AABUS

Pass/Fail

2.6.25

 

The above data and fabrication guide provide designers and PCB shop for their reference. We believe that these information are accurate, however, the data may vary depend on the test methods and specification used. The actual sales of the product should be according to specification in the agreement between ITEQ and its customer. ITEQ reserves the right to revise its data at any time without notice and maintain the best information available to users.

   
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