|
Features
- High Thermal conductivity >2W and Al based-material
- Halogen and Antimony- free
- Tg ≥100℃ (DSC)
- Excellent thermal resistance and reliability
- Good moisture resistant
- High thermal decomposition temperature (Td)
- Lead-free process compatible.
Properties
|
ITEQ Laminate/ Prepreg : IT-859GTABS / IT-859GTA
IPC-4101A Spec / 21 for Reference |
|
LAMINATE (IT-859GTA) |
|
Property |
Thickness<0.50 mm
[0.0197 in] |
Thickness≧0.50 mm
[0.0197 in] |
Units |
Test Method |
|
Typical Value |
Spec |
Typical Value |
Spec |
Metric
(English) |
IPC-TM-650
(or as noted) |
|
Peel Strength, minimum
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil]
B. Standard profile copper foil
1. After Thermal Stress
2. At 125°C [257 F] |
0.87(5.0)
1.22(7.0)
1.05(6.0) |
0.70(4.0)
0.80 (4.57)
0.70 (4.00) |
0.87(5.0)
1.22(7.0)
1.05(6.0) |
0.70(4.0)
1.05 (6.00)
0.70 (4.00) |
N/mm
(lb/inch) |
2.4.8
2.4.8.2
2.4.8.3 |
|
Volume Resistivity, minimum
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature E-24/125 |
107
-
- |
106
—
103 |
107
- |
---
104
103 |
MW-cm |
2.5.17.1 |
|
Surface Resistivity, minimum
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature E-24/125 |
105
-
- |
104
—
103 |
-
105
- |
---
104
103 |
MW |
2.5.17.1 |
|
Moisture Absorption, maximum |
- |
— |
0.10 |
0.8 |
% |
2.6.2.1 |
|
Dielectric Breakdown, minimum |
- |
— |
50 |
-- |
kV |
2.5.6 |
|
Permittivity at 1 MHz, maximum
(Laminate & Prepreg as laminated) |
5.0 |
5.4 |
5.0 |
5.4 |
— |
2.5.5. |
|
Loss Tangent at 1 MHz, maximum
(Laminate & Prepreg as laminated) |
0.020 |
0.035 |
0.020 |
0.035 |
— |
2.5.5. |
|
Flexural Strength, minimum
A. Length direction
B. Cross direction |
-
- |
—
— |
480(70,000)
450(65,400) |
415 (60,190)
345 (50,140) |
N/mm2
(lb/in2) |
2.4.4 |
|
Arc Resistance, minimum |
- |
60 |
100 |
60 |
S |
2.5.1 |
|
Thermal Stress 10 s at 288°C [550.4F],minimum
A. Unetched
B. Etched |
Pass
Pass |
Pass Visual
Pass Visual |
Pass
Pass |
Pass Visual
Pass Visual |
Rating |
2.4.13.1 |
|
Electric Strength, minimum
(Laminate & Prepreg as laminated) |
1000 |
-- |
- |
— |
Volts/mil |
2.5.6.2 |
|
Dielectric Withstand Voltage (Hi-Pot) |
4000/2000 |
2000/1000 |
-- |
-- |
VDC/VAC |
2.5.7.2 |
|
Flammability,
(Laminate & Prepreg as laminated) |
V-0 |
V-0 |
V-0 |
V-0 |
Rating |
UL94 |
|
Glass Transition Temperature |
105 |
100 - 150 |
105 |
100 - 150 |
˚C |
2.4.25 |
|
Decomposition Temperature |
- |
— |
380 |
- |
˚C |
2.3.24.6
(5% wt loss) |
|
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C |
-
-
- |
—
—
— |
40
250
3.5 |
-
-
-
|
PPM/˚C
PPM/˚C
% |
2.4.24 |
|
Thermal Resistance
A. T260
B. T288 |
-
- |
—
— |
>60
>60 |
-
-- |
Minutes
Minutes
|
2.4.24.1 |
|
PREPREG( IT-859GTABS) |
|
|
|
Typical Value |
Specification |
Units |
Test Method |
|
|
1. Shelf Life, minimum (Condition 1/Condition 2) |
Meet requirement |
180/90 |
Days |
AABUS |
|
|
2. Volatile content maximum |
1.0 |
2.0 |
% |
2.3.19 |
|
|
*AABUS = As agreed upon between user and supplier. |
|
|
|
|
|
|
|
|
Laminate Construction
|
Nominal Thickness |
Tolerance |
Construction |
|
mil |
mm |
mil |
mm |
|
3 |
0.08 |
±0.5 |
±0.013 |
106 |
|
4 |
0.10 |
±0.5 |
±0.013 |
106 |
|
5 |
0.13 |
±0.7 |
±0.018 |
106 |
|
Scope : This specification covers ANSI FR-4 thin laminate for use in manufacture of multilayer printed wiring board |
|
|
Recommended Process guideline for IT859GTA
IT-859GTABS/IT-859GTA
High-Tg (Tg>100℃), Halogen-free, Lead-free process Compatible
----------------------------------------------------------------------------------------------------------------------------------
Process Guideline
1. Prepreg Handling & Storage
(1) Shelf life is at least 3 months when prepregs stored in a cool dry environment (Temperature: <23 ℃ and Humidity: <60%).
(2) Prepreg exposed to humidity should be resealed to minimize moisture of absorption.
(3) Prepreg should be stored in controlled environment for 12 hours prior to use.
(4) Prepreg supplied in rolls or panels should be stored horizontally. To avoid damage, no stacking is recommended.
2. Laminate Handling & Storage
(1) Laminates should be stored in a dry environment
(2) Laminate should always be stored flat
3. Inner Layer Process
(1) First around must be take and find a suitable parameter (as dimension compensation, etc) before mass production.
(2) Inner layers should be baked for at least 40 min at 120 ℃ after black or brown oxides treatment.
Note: The material temperature is not allowed to >190 ℃ in lamination process if brown oxide treatment.
4. Lamination Overview
(1) Stacks must be prepared in lay-up room to avoid moisture absorption.
(2) Stacks with the core and prepreg is recommended to use the vacuum process for 30 minutes before heated. Recommended pressure ranges should be as follows: Hydraulic/400~500psi Vacuum Hydraulic 400~500psi
(3) For Lien Chieh Machinery, heating rate is 1.5~2.0℃/min from 80℃ to 140℃, and for Burkle Machinery, the heating rate is 1.6~3.0℃/min from 80℃ to 140℃. Cooling rate is below 3℃/min.
(4) When the board temperature reaches 180℃ during the pressing process, hold for at least 60 minutes.
5. Drilling
Drilling parameters are mainly dependent on hole size, layer thickness, layer number, copper thickness and stack height. The following drilling parameters are for reference only. Typical drilling parameters for 0.4~1.0 mm drills are as follows:
From :Aluminum side drill & punch ,routing
Spindle speed: 45~105 KRPM Feed rate: 50~150 IPM
Retract rate: 500~1000 IPM Max. hit count: <1000 HITS
Stack height: ≤2pnls(2~6layers), 1pnl(≥8layers) Entry Material: 0.2mm Aluminum
Back-up Material: 1.5mm Phenolic laminate Drilling Machine: Hitachi ND-6L210E
Baking condition: After Drilling: 120 °C /2 hours
6. Desmear
The following desmear parameter is reference only :
Horizontal (JETCHEM)
Swell : 75℃ for 100 s Mn+7 : 55-65 g/ l at 85℃ for 180s
Vertical (ROHMHAAS)
Swell : 65℃ for 365 s Mn+7 : 65-75 g/ l at 75℃ for 750s
Normally, the typical parameters used to desmear FR-4 product may not produce optimum hole topography for IT-859GTA, so you should consult with your chemistry supplier to optimize your desmear condition, as desmear two times or adjust other parameter, etc.
www.iteq.com.tw
|
Factory |
Address |
Tel |
Fax |
Contact |
E - Mail |
|
Taiwan |
22,Kung Yen 1st Rd. Ping Chen Industry Zone. Ping Chen, Taoyuan, Taiwan, R.O.C. |
886-3-4191130 |
886-3-4191131 |
Anderson |
anderson@iteq.com.tw |
|
South China |
168,dongfang Road,Nanfang Industrial Park,Beice VillageHumen Town,Dongguan City,Guangdong Province,China |
86-769-8623268 |
86--769-5700426 |
AndyChen |
andychen@iteq.com.tw |
|
East China |
Chun Hui Rd.,Xishan Economic Development Zone,Wuxi City,Jiangsu Province,China |
86-510-2235888 |
86-510-2235889 |
R.X.Lo |
rx-lo@wxiteq.com |
|
IT-859GTA
