IT-180G no/low flow prepreg is a halogen free High Tg (>170℃ by DSC) multifunctional epoxy. It’s designed for rigid flex board and heat sink bonding application.
Rigid Flex Board
Halogen-Free, Phosphorous-containing Epoxy Prepreg
Superior bonding strength to bonding sheet prepreg
Low powder for punching processing
Minimal and uniform flow performance
Good thickness uniformity and flatness
IT-180I is a standard loss, high Tg (175℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability. It is designed for high layer count PCB and it can pass 260℃ Lead free assembly process.
Multilayer and High Layer count PCB
Server and Networking
Excellent CAF resistance
Low CTE & Standard Loss performance
Lead Free , High Tg and high thermal reliability
For high layer count PCB applications
IT-189 is an advanced high Tg (170℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability and CAF resistance. It’s suitable for automotive applications with 260℃ lead free assembly.
Automotive (Engine room ECU)
Multilayer and HDI PCB
High heat resistance
Excellent CAF resistance (1000 Volts)
Good through-hole reliability