IT-858GTC
IT-858GTC is an advanced high Tg (200℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability and CAF resistance. It’s suitable for automotive applications with 260℃ lead free assembly.
Application
Automotive (Engine room ECU)
Multilayer and HDI PCB
Heavy Copper
Key Features
Low CTE
High heat resistance
Excellent CAF resistance (1000 Volts)
Good through-hole reliability
Property
Items |
Methods |
IT-858GTC |
Tg (℃) |
DSC |
200 |
T-288 (w/ 1oz Cu, min) |
TMA |
>60 |
Td-5%(℃ ) |
TGA 5% loss |
395 |
CTE (ppm/℃) |
a1/a2 |
35/160 |
CTE (%), 50-260℃ |
TMA |
1.4 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.67 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.014 |
*The sample thickness : 0.76mm.
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IT-180GNBS
IT-180GNBS no/low flow prepreg is a halogen free High Tg (175℃ by DSC) multifunctional epoxy. It’s designed for rigid flex board and heat sink bonding application.
Application
Rigid Flex Board
Key Features
Halogen-Free, Phosphorous-containing Epoxy Prepreg
Superior bonding strength to bonding sheet prepreg
Low powder for punching processing
Minimal and uniform flow performance
Good thickness uniformity and flatness
Property
Items |
Methods |
IT-180GNBS |
Tg (℃) |
DSC |
175 |
T-288 (w/ 1oz Cu, min) |
TMA |
>30 |
Td-5%(℃ ) |
TGA 5% loss |
365 |
CTE (ppm/℃) |
a1/a2 |
50/275 |
CTE (%), 50-260℃ |
TMA |
2.9 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.0 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.016 |
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IT-180ITC
IT-180ITC is a standard loss, high Tg (175℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability. It is designed for high layer count PCB and it can pass 260℃ Lead free assembly process.
Application
Multilayer and High Layer count PCB
Backplanes
Server and Networking
Telecommunications
Key Features
Excellent CAF resistance
Low CTE & Standard Loss performance
Lead Free , High Tg and high thermal reliability
For high layer count PCB applications
Property
Items |
Methods |
IT-180ITC |
Tg (℃) |
DSC |
175 |
T-288 (w/ 1oz Cu, min) |
TMA |
>30 |
Td-5%(℃ ) |
TGA 5% loss |
350 |
CTE (ppm/℃) |
a1/a2 |
40/210 |
CTE (%), 50-260℃ |
TMA |
2.3 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.0 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.015 |
*The sample thickness : 0.76 mm
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IT-180ATC
IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various application and can pass 260℃ lead free assembly.
Application
Automotive (Engine room ECU)
Multilayer and HDI PCB
Backplanes
Data Storage
Server and Networking
Telecommunications
Heavy Copper
Key Features
Low CTE
High heat resistance
Excellent CAF resistance
Good through-hole reliability
Property
Items |
Methods |
IT-180ATC |
Tg (℃) |
DSC |
175 |
T-288 (w/ 1oz Cu, min) |
TMA |
20 |
Td-5%(℃ ) |
TGA 5% loss |
345 |
CTE (ppm/℃) |
a1/a2 |
45/210 |
CTE (%), 50-260℃ |
TMA |
2.7 |
Dk @ 1 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.4 |
Df @ 1 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.015 |
CTI (Volts) |
IEC 60112 / UL 746 |
175-249 |
*The sample thickness : 0.76 mm
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IT-189TC
IT-189TC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability and CAF resistance. It’s suitable for automotive applications with 260℃ lead free assembly.
Application
Automotive (Engine room ECU)
Multilayer and HDI PCB
Heavy Copper
Key Features
Low CTE
High heat resistance
Excellent CAF resistance (1000 Volts)
Good through-hole reliability
Property
Items |
Methods |
IT-189TC |
Tg (℃) |
DSC |
175 |
T-288 (w/ 1oz Cu, min) |
TMA |
25 |
Td-5%(℃ ) |
TGA 5% loss |
350 |
CTE (ppm/℃) |
a1/a2 |
35/230 |
CTE (%), 50-260℃ |
TMA |
2.4 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.1 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.016 |
*The sample thickness : 0.76 mm
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IT-180TC
IT-180TC is an advanced high Tg (175℃ by DSC) multifunctional epoxy based with high thermal reliability and CAF resistance. It’s suitable for various application and can pass 260℃ lead free assembly.
Application
Automotive
Multilayer and High Layer PCB
Backplanes
Data Storage
Server and Networking
Telecommunications
Heavy Copper
Key Features
High heat resistance
Excellent CAF resistance
Good through-hole reliability
Property
Items |
Methods |
IT-180TC |
Tg (℃) |
DSC |
175 |
T-288 (w/ 1oz Cu, min) |
TMA |
20 |
Td-5%(℃ ) |
TGA 5% loss |
350 |
CTE (ppm/℃) |
a1/a2 |
50/250 |
CTE (%), 50-260℃ |
TMA |
3.0 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.0 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.020 |
*The sample thickness : 0.76 mm